Publication Type:

Patent

Source:

Number US 11/224,767, USA (2006)

URL:

https://www.google.com/patents/US20060137609

Abstract:

A wafer processing apparatus includes one or more processing modules, each having multiple, distinct, single-wafer processing reactors configured for semi-independent ALD and/or CVD film deposition therein; a robotic central wafer handler configured to provide wafers to and accept wafers from each of said wafer processing modules; and a single-wafer loading and unloading mechanism that includes a loading and unloading port and a mini-environment coupling the loading and unloading port to the robotic central wafer handler. The wafer processing reactors may be arranged (i) along axes of a Cartesian coordinate system, or (ii) in quadrants defined by said axes, one axis being parallel to a wafer input plane of the at least one of the process modules to which the single-wafer processing reactors belong. Each processing module can include up to four single-wafer processing reactors, each with an independent gas distribution module.

Cite this Research Publication

J. Puchacz, Dr. Sasangan Ramanathan, Reyes, M., and Seidel, T., “Multi-single Wafer Processing Apparatus”, U.S. Patent US 11/224,7672006.

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