Publication

Abstract : This research investigates the augmentation of thermal conductivity in Aluminium alloy 6063 to optimize its performance for heat sink applications in power transistors, optoelectronics, and computer CPUs. Aluminium 6063, chosen for its superior extrudability and corrosion resistance, serves as the base material. Titanium, a commonly employed alloying element for property enhancement is incorporated using a stir casting procedure, generating alloy specimens with varying titanium content. Homogenization and aging processes are applied to the alloy samples. The study employs a heat flow meter test to quantify thermal conductivity changes relative to the reference metal, Aluminium 6063. Tensile strength testing is also conducted to assess mechnical characteristics of the advanced mettalic compositions. The anticipated outcomes include significant improvements in thermal conductivity and potential enhancements in tensile strength. This research holds implications for advancing heat sink technology, particularly in electronic devices requiring efficient heat dissipation. The paper discusses the methodology, results, and challenges encountered, and offers insights for future investigations.