Publication Type : Conference Proceedings
Publisher : Proceedings of IEEE International Conference on Signal Processing and Communication, ICSPC 2017
Source : Proceedings of IEEE International Conference on Signal Processing and Communication, ICSPC 2017, Institute of Electrical and Electronics Engineers Inc., Volume 2018-January, p.375-379 (2018)
Url : https://www.scopus.com/inward/record.uri?eid=2-s2.0-85046974477&doi=10.1109%2fCSPC.2017.8305873&partnerID=40&md5=80a73cb178650b71d27750f86a0d3368
ISBN : 9781509067305
Keywords : Accuracy and precision, Classification (of information), Classification errors, Image Enhancement, Image features, Image segmentation, Level Set method, Level set segmentation, Numerical methods, Object Detection, Salient region detections, Segmentation techniques, Standard performance
Campus : Coimbatore
School : School of Engineering
Department : Computer Science
Year : 2018
Abstract : Image segmentation is a challenging task in computer vision and image understanding, which partitions an input image in to several segments. Segmentation techniques try to detect objects from the background by exploiting image features such as texture, intensity, color etc. This paper introduces an enhanced Level set based method for segmentation using the saliency map as the initialization. A high quality saliency map is generated by combining the maps from HDCT and MB algorithms, the resultant saliency map is then given to the Level set module for segmentation. The effectiveness of the saliency based level set method against normal level set segmentation is evaluated and confirmed on MSRA dataset based on standard performance measures such as Miss Classification Error, FPR, FNR, TPR, accuracy and precision. © 2017 IEEE.
Cite this Research Publication : B. Sriram, Reddy, K. S. H., Kumar, S. S., and Sikha O. K., “An improved levelset method using saliency map as initial seed”, Proceedings of IEEE International Conference on Signal Processing and Communication, ICSPC 2017, vol. 2018-January. Institute of Electrical and Electronics Engineers Inc., pp. 375-379, 2018.