Back close
Admissions
Publications
A Construction of Smart Grid Authentication and Key Agreement System Using ECC Cryptography

Publisher : IEEE

Publications
A Three-Factor Authenticated Mobile Key Exchange Protocol Using Matrices Over Group Ring Structure

Publisher : Springer Nature Singapore

Publications
A Construction of Secure and Efficient Lightweight Authenticated Key Agreement Based on Elliptic Curve Cryptography for Smart Grid

Publisher : Springer Nature Singapore

Publications
Post Quantum Secure Blockchain Architecture for Data Dissemination

Publisher : Springer Nature Singapore

Publications
Security Issues and Solutions in Post Quantum Authenticated Key Exchange for Mobile Devices

Publisher : Springer Nature Singapore

Publications
Anonymous quantum-safe secure and authorized communication protocol under dynamic identities for Internet of Drones

Publisher : Elsevier BV

Publications
Drug Resistance Mechanism of L10F, L10F/N88S and L90M mutations in CRF01_AE HIV-1 protease: Molecular dynamics simulations and binding free energy calculations

Authors : Vasavi C S, Tamizhselvi R, Munusami P.

Publisher : Elsevier

Publications
Multimodal Approach for Code-Mixed Speech Sentiment Classification

Authors : B. Premjith, Keshav, S, G. Jyothish Lal

Publisher : Advances in Signal Processing, Embedded Systems and IoT

Publications
A Novel Approach to Text Summarisation Using Topic Modelling and Noun Phrase Extraction

Publisher : SpringerNature

Publications
Creating Alert messages based on Wild Animal Activity Detection using Hybrid Deep Neural Networks

Authors : B., Natarajan, R., Elakkiya, Bhuvaneswari, R, Saleem, Kashif, Chaudhary, Dharminder, Samsudeen, Syed

Publisher : IEEE Access

Publications
Heat Conduction with Krylov Subspace Method Using FEniCSx

Authors : Kumar V, Chandan K, Nagaraja KV, Reddy MV

Publisher : Energies

Publications
Efficient study of Aerodynamic Characteristics over NACA 0012 at 1000 Reynolds number using subparametric transformations in Micro Air Vehicle application

Authors : Chandan K, Nagaraja KV, Devi S.

Publisher : IEEE

Admissions Apply Now