Authors : S. Sree Lekshmi, N.B. Sai Shibu, P.S. Nithin, Seshaiah Ponnekanti
Publisher : International Conference on Wireless Communications Signal Processing and Networking (WiSPNET), IEEE, Chennai, India.
Authors : Shantanu Bhowmik, Chaki, TK, Ray, S
Publisher : India Rubber Expo
Authors : Shantanu Bhowmik, Chaki, TK
Publisher : Fourth International Symposium on Polymer Surface Modification: Relevance to Adhesion, Novotel, Toronto Centre
Publisher : SWISSBONDING 06: 20th International Congress of Adhesion and Bonding Technology
Authors : Sandipan Ray, Shantanu Bhowmik, Ghosh, PK
Publisher : International Symposium on Polymer Surface Modification: Relevance to Adhesion, Newark, NJ, USA.
Authors : Benedictus, R, Shantanu Bhowmik, Poulis, JA, Akram, M
Publisher : Florida Institute of Technology
Authors : Dhanesh Raj, S. Sree Lekshmi, Bhavana B. Nair, Seshaiah Ponnekanti
Publisher : International Conference on Wireless Communications Signal Processing and Networking (WiSPNET), IEEE, Chennai, India .
Authors : Shantanu Bhowmik, Weir, RD, Bonin, HW, Bui, VT
Publisher : SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology
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Publisher : 5th International Conference on Thin Walled Structures
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Publisher : he Fifth Canadian International Composites Conference CANCOM
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Publisher : Journal of A. E
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Publisher : International Conference on RADIATION PROCESSING: Value addition for Food, Agro, Healthcare and Other Industrial Products
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