Publication Type : Journal Article
Publisher : IEEE Microwave and Wireless Components Letters
Source : IEEE Microwave and Wireless Components Letters, Institute of Electrical and Electronics Engineers Inc., Volume 29, Number 2, p.92-94 (2019)
Url : https://www.scopus.com/inward/record.uri?eid=2-s2.0-85061788636&doi=10.1109%2fLMWC.2018.2886193&partnerID=40&md5=d0bb1adbbde539e580426aefacce54b5
Keywords : Bandwidth, Comparator circuits, Comparators (optical), Electric network analyzers, Electrical performance, Electro discharge machining, Electromagnetic simulation, Low earth orbit satellites, Magic tees, Monopulse, Orbits, Satellite communication systems, Satellite communications, Satellite tracking, Satellites, Tracking (position), Vector network analyzers
Campus : Bengaluru
School : School of Engineering
Department : Electronics and Communication
Year : 2018
Abstract : This letter deals with the design, electromagnetic simulation, and test results of a novel broadband Magic Tee for Ka-band (25.5-27 GHz) satellite communications. Novel matching structure is implemented in the Magic Tee, which results in better electrical performances over broad bandwidth. The designed Magic Tee is realized using electro-discharge machining fabrication technique for achieving stringent dimensional accuracy. The measured bandwidth of the Magic Tee is approximately 16% with a maximum measured in-band insertion loss of 0.2 dB. The simulation results of the developed Magic Tee are compared with measured results using a vector network analyzer showing excellent agreement. The Magic Tee introduced in this letter can be used for designing a monopulse comparator for low earth orbit satellite tracking applications since the amplitude imbalance and phase imbalance of the Magic Tee are negligible, which result in excellent tracking performances. © 2001-2012 IEEE.
Cite this Research Publication : V. S. Kumar and Dr. Dhanesh G. Kurup, “A new broadband magic tee design for ka-band satellite communications”, IEEE Microwave and Wireless Components Letters, vol. 29, pp. 92-94, 2019.