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The Psychological Contract: An Exploration in the Online Learning Environment*

Publication Type : Conference Paper

Publisher : IEEE

Source : 2023 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC)

Url : https://doi.org/10.1109/temscon-aspac59527.2023.10531301

Campus : Kochi

School : School of Business

Year : 2023

Abstract :

The increasing adoption of technology in educational environments, specifically the widespread availability of Massive Open Online Courses (MOOCs), highlights the necessity of exploring the implicit agreements between teachers and students. The analysis of psychological contracts, which involves implicit and reciprocal expectations, is justified in the context of online education, even if it primarily concentrates on studying the dynamics between employers and employees. The main objective of this study is to offer a comprehensive understanding of the attributes and consequences of agreements between online learners and educators. This study aims to comprehensively understand the intricate nature of psychological contracts and investigate the corresponding student expectations and satisfaction in the context of virtual academic platforms. This is accomplished through a rigorous examination of data about participation in online courses, coupled with a detailed evaluation of pertinent scholarly literature. The research demonstrates some inherent limitations within the domain of online education. The role of interpersonal communication is crucial in the facilitation of team building. Establishing a connection between course obligations and their execution is significant since perceived breaches may lead to substantial repercussions. Research has indicated that providing academic support benefits students' self-esteem and motivation toward their academic pursuits. © 2023 IEEE.

Cite this Research Publication : Murale Venugopalan, Vandana Madhavan, R Preetha, The Psychological Contract: An Exploration in the Online Learning Environment*, 2023 IEEE Technology & Engineering Management Conference - Asia Pacific (TEMSCON-ASPAC), IEEE, 2023, https://doi.org/10.1109/temscon-aspac59527.2023.10531301

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