Publication Type : Journal Article
Publisher : Advanced Metallization and Interconnect Systems for ULSI Applications
Source : Advanced Metallization and Interconnect Systems for ULSI Applications in 1997, p.635–640 (1997)
Campus : Amritapuri
School : School of Engineering
Center : TBI
Department : cyber Security, Chemical
Year : 1997
Abstract :
Cite this Research Publication : K. Achuthan, Hetherington, D. L., and Babu, S. V., “Wear rate characterization of CMP pads using laser scanning confocal microscopy”, Advanced Metallization and Interconnect Systems for ULSI Applications in 1997, pp. 635–640, 1997.