Programs
- M. Tech. in Automotive Engineering -Postgraduate
- B.Sc. (Honours) in Microbiology and lntegrated Systems Biology -
Authors : Dr. Laxman Vaitla, Dr. Ratna Kishore V.; , Thiagarajan, V., Purushothaman, R.K., Srikrishnan, V.A., Srikumar, G
Publisher : Journal of Aerospace Engineering, American Society of Civil Engineers (ASCE)
Authors : Sree Lekshmi S, Seshaiah Ponnekanti
Publisher : EAI Endorsed Transactions on Cloud Systems, EAI.
Authors : S. Sree Lekshmi, N.B. Sai Shibu, P.S. Nithin, Seshaiah Ponnekanti
Publisher : International Conference on Wireless Communications Signal Processing and Networking (WiSPNET), IEEE, Chennai, India.
Authors : Shantanu Bhowmik, Chaki, TK, Ray, S
Publisher : India Rubber Expo
Authors : Shantanu Bhowmik, Chaki, TK
Publisher : Fourth International Symposium on Polymer Surface Modification: Relevance to Adhesion, Novotel, Toronto Centre
Publisher : SWISSBONDING 06: 20th International Congress of Adhesion and Bonding Technology
Authors : Sandipan Ray, Shantanu Bhowmik, Ghosh, PK
Publisher : International Symposium on Polymer Surface Modification: Relevance to Adhesion, Newark, NJ, USA.
Authors : Benedictus, R, Shantanu Bhowmik, Poulis, JA, Akram, M
Publisher : Florida Institute of Technology
Authors : Dhanesh Raj, S. Sree Lekshmi, Bhavana B. Nair, Seshaiah Ponnekanti
Publisher : International Conference on Wireless Communications Signal Processing and Networking (WiSPNET), IEEE, Chennai, India .
Authors : Shantanu Bhowmik, Weir, RD, Bonin, HW, Bui, VT
Publisher : SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology
Authors : Shantanu Bhowmik, J. A, Poulis, R. Benedictus
Publisher : 5th International Conference on Thin Walled Structures
Authors : Bonin, HW, Shantanu Bhowmik, Bui, Van Tam
Publisher : he Fifth Canadian International Composites Conference CANCOM