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Publication Type : Conference Paper
Publisher : SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology
Source : SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland (2005)
Campus : Coimbatore
School : Department of Aerospace Engineering, School of Engineering
Department : Aerospace
Year : 2005
Abstract :
Cite this Research Publication : V. T. Bui, Weir, R. D., Bonin, H. W., and Shantanu Bhowmik, “Adhesion and Durability of High Performance Polymer under Space and Radiation Environments (Invited Author)”, in SWISSBONDING 05: 19th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland , 2005.