Publication Type : Conference Paper
Publisher : SWISSBONDING 06: 20th International Congress of Adhesion and Bonding Technology
Source : SWISSBONDING 06: 20th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland, 2006.
Campus : Coimbatore
School : Department of Aerospace Engineering, School of Engineering
Department : Aerospace
Year : 2006
Abstract :
Cite this Research Publication : V. T. Bui, Bonin, H. W., Weir, R. D., and Shantanu Bhowmik, “High Performance Nano Adhesive Bonding of High Temperature Resistant Polymer to Titanium for Aviation and Space Applications (Invited Author)”, in SWISSBONDING 06: 20th International Congress of Adhesion and Bonding Technology, Lake of Zurich, Switzerland, 2006.