Programs
- M. Tech. in Automotive Engineering -Postgraduate
- Building Disaster Resilience and Social Responsibility through Experiential Learning: Integrating AI, GIS, and Remote Sensing -Certificate
Authors : Dr. Bhavani Rao R., Sugunan, N., Krishna, ,,, K, S
Publisher :International Confernece on Distributed Computing, VLSI, Electrical Circuits and Robotics.
Authors : Dr. Prashanth B N, Dr. Pramod R., R. Pramod, G. B. Veeresh Kumar
Publisher :Materials Today: Proceedings
Authors : Dr. Manitha P. V., Anandaraman; Sudharsan, S.; Manikumaran, K.; Aswathaman, K.
Publisher :ICECDS
Authors : Dr. Maneesha Vinodini Ramesh, Rekha Prabha; Emrick Sinitambirivoutin; Florian Passelaigue .
Publisher :International Conference on Wireless Communications Signal Processing and Networking .
Authors : Dr. Sreevidya B., Mamatha T. M., Dr. Rajesh M.
Publisher :Advances in Intelligent Systems and Computing, Springer Verlag
Publisher :IOP Conference Series: Materials Science and Engineering
Authors : Tamilarasan N., Late Dr. Thirumalini S. (Memorial Page), George, L.K.
Publisher :IOP Conference Series: Materials Science and Engineering
Authors : Dr. Sreedevi K. Menon, R. Deepak .
Publisher :2018 IEEE MTT-S International Microwave and RF Conference (IMaRC), IEEE, Kolkata, India.
Authors : Mohankumar N., B Aksshaya; G Madhura L. V.; Nivethashri S; Vishnuvarthini T .
Publisher :International Journal of Engineering & Technology.
Authors : Dr. Pramod Sreedharan, Dr. Ganesha Udupa, Rachakonda Praneeth, N V Sai Kiran, Aditya S, Anjai Krishnan
Publisher :Materials Today: Proceedings
Authors : Dr. Rahul Krishnan Pathinarupothi, Durga P., Ekanath Srihari Rangan
Publisher :40th International Conference of the IEEE Engineering in Medicine and Biology Society (EMBC 18) , Honolulu, Hawaii .
Authors : Dr. Govind D., Dr. Sowmya V., Dr. Soman K. P., Sachin, R.
Publisher :Springer International Publishing AG 2018