Authors : Viswesh Sujjur Balaramraja, Viswesh Sujjur Balaramraja, S. Eashwra Sankrityayan, S. Eashwra Sankrityayan, Suraj Coimbatore Sivagurunathan, Suraj Coimbatore Sivagurunathan, Dr. Balajee Ramakrishnananda, Dr. Balajee Ramakrishnananda, Rajesh Senthil Kumar T., Rajesh Senthil Kumar T.
Publisher : International Conference on Advances in Computing, Communications and Informatics (ICACCI-2016)
Authors : Shantanu Bhowmik, S. Ahmed, D. Chakroborty, S. Mukherjee
Publisher : Journal of Adhesion Science and Technology
Authors : Iqbal, HMS, Shantanu Bhowmik, Bhatnagar, N, Mondal, S, Ahmed, S
Publisher : Taylor & Francis
Authors : S. Iqbal, HM, Shantanu Bhowmik, Benedictus, R, Moon, JB, Kim, CG, Mourad, A-HI
Publisher : Journal of Thermophysics and Heat Transfer
Authors : Bhatnagar, Nitu, Pyngrope, Davidson, Pradhan, Rajiv, Jha, Sangeeta, Shantanu Bhowmik, Poulis, Hans, Bui, Van Tam, Bonin, Hughes
Publisher : Journal of Polymer Engineering
Authors : Akram, M, Jansen, KMB, Ernst, LJ, Shantanu Bhowmik
Publisher : Elsevier
Authors : Iqbal, HMS, Shantanu Bhowmik, Poulis, JA, Benedictus, R
Publisher : Polymer Engineering Science
Authors : Bhatnagar, Nitu, Jha, Sangeeta, Shantanu Bhowmik
Publisher : Advanced Materials Letters
Authors : Bhatnagar, N, Jha, S, Shantanu Bhowmik
Publisher : Inventi Impact: Tech Research & Reviews, Inventi Journals (P) Ltd
Authors : Bhatnagar, Nitu, Jha, Sangeeta, Shantanu Bhowmik, Gupta, Govind, Moon, JB, Kim, CG
Publisher : Springer
Authors : Sundaram, A.S., Eranezhuth, A.A., Krishna, K.V.V.R., Kumar, P.K., Dr. Sivakumar V.
Publisher : Journal of Failure Analysis and Prevention, Springer New York LLC
Prev