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Achieving Covertness in the Wireless Mode-based Communication in the IoT Connection with use of THZ Band and AWGN Channel

Publication Type : Conference Paper

Publisher : IEEE

Source : 2023 Second International Conference on Trends in Electrical, Electronics, and Computer Engineering (TEECCON)

Url : https://doi.org/10.1109/teeccon59234.2023.10335770

Campus : Chennai

School : School of Engineering

Department : Electronics and Communication

Year : 2023

Abstract : If covert communication is employed, an opponent might not be conscious of the communication taking place intermediary to the 2 users. This study investigates covert wireless mode-based interactions in a thickly distributed IoT connection wherein 1 IoT gadget experiences noise from the background as well as combined interference caused by remaining Tx devices. Communication with covertness gets challenging in a network of IoT devices using THz (Terahertz) Band because Willie can effortlessly place a receiving medium in the tiny beam separating Bob and Alice to detect or prohibit their LOS links. We demonstrated that communication with covertness remains viable in this circumstance by making use of diffuse scattering or reflection from a surface that’s rough. With regards to the security of the physical layer, communication with covertness could increase the security of the IoT connection from the bottom layer up. Between 300 and 350 GHz is the lowest frequency range that can be used in a covert environment without having any negative effects on covert communications. The effect will be exponentially grown as we reduce the frequency ranges, which will be validated via the simulation and its outcomes.

Cite this Research Publication : S. Venkateswarlu Reddy, N Kirn Kumar, Jarapala Siva Naik, Rathaiah Meram, N. Ramesh, Rahul S G, Achieving Covertness in the Wireless Mode-based Communication in the IoT Connection with use of THZ Band and AWGN Channel, 2023 Second International Conference on Trends in Electrical, Electronics, and Computer Engineering (TEECCON), IEEE, 2023, https://doi.org/10.1109/teeccon59234.2023.10335770

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