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Effect of nanoparticles on the dielectric strength and PD resistance of epoxy nanocomposites

Publication Type : Journal Article

Publisher : Advances in Intelligent Systems and Computing

Source : Advances in Intelligent Systems and Computing, Springer Verlag, Volume 397, p.277-286 (2016)

Url : http://www.scopus.com/inward/record.url?eid=2-s2.0-84955309200&partnerID=40&md5=64428e1444fdcfd5a56c5e47cfb8b605

ISBN : 9788132226697

Keywords : Dielectric properties of solids, Dielectric strengths, Dispersion of nano particles, Epoxy nanocomposites, Experimental analysis, Filler concentration, Fillers, Influence of water, Molecules, Nanocomposites, Nanoparticles, Partial discharge inception voltage, Partial discharge resistance, Partial discharges, Silicates, Soft computing

Campus : Coimbatore

School : School of Engineering

Department : Electrical and Electronics

Year : 2016

Abstract : The dielectric strength and partial discharge resistance of epoxy material are enhanced by the addition of nanomaterial as fillers. The enhancement depends on the type of nanofiller and percentage loading. Epoxy nanocomposites with a good dispersion of nanoparticles in the base epoxy were prepared and experiments were conducted to measure the dielectric strength and partial discharge resistance with PDIV. In addition, the influence of water molecule on dielectric strength and PD resistance in base epoxy and epoxy nanocomposites were studied. This paper deals with the experimental analysis of dielectric strength and PD resistance of the nanocomposites with four types of insulating nanofillers, viz., CaCO3, TiO2, Al2O3, and layered silicate are analyzed at different filler concentration by weight. Results are given for both dry and wet (water absorbed) samples. © Springer India 2016.

Cite this Research Publication : Da Kavitha, Sindhu, T. Kb, and Nambiar, T. N. Pa, “Effect of nanoparticles on the dielectric strength and PD resistance of epoxy nanocomposites”, Advances in Intelligent Systems and Computing, vol. 397, pp. 277-286, 2016.

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