Publication Type : Journal Article
Publisher : Elsevier BV
Source : Materials Chemistry and Physics
Url : https://doi.org/10.1016/j.matchemphys.2021.125667
Keywords : Superhydrophobicity, Contact angle, Self-cleaning, Anti-icing, Condensation
Campus : Amaravati
School : School of Computing
Department : Computer Science and Engineering
Year : 2022
Abstract : Robust superhydrophobicity is of immense practical interest in a wide range of applications including self-cleaning, anti-icing, anti-corrosion, atmospheric water harvesting, desalination, condensation, and oil-water separation. However, biohazard associated with the prevalent use of per-fluorinated synthetic chemicals in making these surfaces and the gradual loss of superhydrophobicity have been major roadblocks. Here we develop an environment-friendly and industrially scalable superhydrophobic copper surface using a combination of electrochemical deposition and Lauric acid functionalization. We optimized the synthesis process for ensuring the robustness of these superhydrophobic surfaces. The surface exhibits contact angles as high as 158° with excellent droplet rebounding, self-cleaning, anti-icing, and dropwise condensation abilities. Thermal stability in the range of 
 
 −
 15
 °C
 
 to 
 
 150
 °C
 ,
 
 mechanical robustness against abrasion, chemical stability under aqueous, acidic, and basic medium, and the excellent plastron layer stability under long-time underwater immersion attest to the high quality of superhydrophobic surfaces for large-scale applications. These coatings when implemented on the curved surface of a copper tube demonstrated appreciable improvement in condensation behavior. Our method provides a sustainable approach for suitable technological interventions in energy and potable water applications requiring robust environment-friendly superhydrophobic surfaces.
Cite this Research Publication : Bathina Chaitanya, Madhu Ranjan Gunjan, Rabindranath Sarangi, Rishi Raj, Ajay D. Thakur, Per-fluorinated chemical free robust superhydrophobic copper surface using a scalable technique, Materials Chemistry and Physics, Elsevier BV, 2022, https://doi.org/10.1016/j.matchemphys.2021.125667