Authors : Kim, CG, Kim, IJ, Moon, JB, Shantanu Bhowmik
Publisher : 2nd Indo Swiss Bonding International Symposium
Publisher : 2nd Indo Swiss Bonding International Symposium
Publisher : SWISSBONDING 07: 21st International Congress of Adhesion and Bonding Technology
Publisher : Journal of Surface Engineering and Applied Electrochemistry
Authors : Shantanu Bhowmik;; .; , Jayanarayanan, K, Remanan, M.S, Peter, P.
Publisher : International Conference on Advances in Materials and Manufacturing Applications
Authors : Shantanu Bhowmik, Patel, Vinay;
Publisher : Reviews of Adhesion and Adhesives
Authors : Shantanu Bhowmik, Akram, M, Jansen, KMB, Ernst, LJ;
Publisher : SAMPE USA 2010 Conference and Exhibition, Seattle, WA, USA
Authors : Shantanu Bhowmik;, Shantanu Bhowmik;, Prakash, H, Prakash, H, Ajeesh, G, Ajeesh, G, Thenarasu, M., Thenarasu, M.
Publisher : Volume 52, Issue 6
Publisher : International Conference on Advances in Materials and Manufacturing Applications, IConAMMA 2017
Authors : Shantanu Bhowmik, Mukherjee, Subroto; , Chakrabarty, Debabrata, Ahmed, Sabbir
Publisher : Volume 26, Issue 3
Authors : Shantanu Bhowmik;, Venkatesan, G.; , Jithin, P. V.;, Rajan, V. T, M. Kumar, R. Rane, S. Mukherjee
Publisher : Journal of Aerospace Engineering
Authors : Shantanu Bhowmik, Manu Remanan, Lalit Varshney, , Mathew Abraham,, ayanarayanan, K.,
Publisher : Journal e Polymers
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